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| TDA2270 TV VERTICAL DEFLECTION OUTPUT CIRCUIT . . . . . . . DRIVES VERTICAL DEFLECTION WINDINGS DIRECTLY HIGH EFFICIENCY INTERNAL FLYBACK GENERATOR THERMAL PROTECTION ON-CHIP VOLTAGE REFERENCE HIGH OUTPUT CURRENT (2.2 A peak) 16-LEAD POWERDIP PLASTIC PACKAGE DIP16 (Plastic package) ORDER CODE : TDA2270 PIN CONNECTIONS DESCRIPTION The TDA2270 is a high efficiency monolithic output stage for vertical deflection circuits in TVs and monitors. Driving the vertical windings directly, the device contains a power amplifier, flyback generator, voltage reference and thermal protection circuit. The TDA2270 is supplied in a 16-pin DIP with the four center pins connected together and used for heatsinking. BLOCK DIAGRAM SUPPLY VOLTAGE FLYBACK GENERATOR NC GND GND NC OUTPUT OUTPUT STAGE SUPPLY 1 2 3 4 5 6 7 8 16 15 NON-INVER TING INPUT INVERTING INPUT NC GND GND NC 2270-01.EPS 14 13 12 11 10 9 GND REFERENCE VOLTAGE +VS 1 8 2 FLYBACK GENERATOR 15 POWER AMP. 7 YOKE 16 REFER ENCE VOLTAGE THERMAL PROTECTION 4 9 12 13 10 5 September 1992 1/7 2270-02.EPS TDA2270 ABSOLUTE MAXIMUM RATINGS Symbol Vs V7 , V8 V2 V15, V16 Io Io Io I2 I2 Ptot Tstg, Tj Supply Voltage (pin 1) Flyback Peak Voltage Voltage at Pin 2 Amplifier Input Voltage Output Peak Current (non repetitive, t = 2 ms) Output Peak Current at f = 50 Hz, t 10 s Output Peak Current at f = 50 Hz, t > 10 s Pin 2 DC Current at V7 < V1 Pin 2 Peak to Peak Flyback Current at f = 50 Hz, tfly 1.5 ms Total Power Dissipation at Tpins 90 C Tamb = 70 C Parameter Value 35 60 + Vs + Vs, - 0.5 2 2.2 1.2 50 2 4.3 1 - 40 to 150 V A A A mA A 2270-01.TBL 2270-03.TBL 2270-02.TBL Unit V V W W C Storage and Junction Temperature THERMAL DATA Symbol Rth j-case R th j-amb Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max Max Value 14 80 Unit C/W C/W * Obtained with the GND pins soldered to printed circuit with minimized copper area. ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35 V, Tamb = 25oC unless otherwise specified) Symbol I1 I8 I15 I16 V2L V7 V7L V7H V9 V9 VS R9 Tj Parameter Pin 1 Quiescent Current Pin 8 Quiescent Current Amplifier Input Bias Current Amplifier Input Bias Current Pin 2 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Reference Voltage Reference Voltage Drift versus Supply Voltage Reference Voltage Output Resistance Junction Temperature for Thermal Shut Down Test Conditions I2 = o, I7 = 0, V16 = 3 V I2 = 0, I7 = 0, V16 = 3 V V15 = 1 V V16 = 1 V I2 = 20 mA Vs = 35 V, Ra = 39 k Vs = 15 V, Ra = 13 k I7 = 0.7 A - I7 = 0.7 A I9 = 0 Vs = 15 to 30 V Min. Typ. 8 16 - 0.1 - 0.1 1 18 7.5 0.7 1.3 2.2 1 2.1 140 2 1 1.8 Max. 16 36 -1 -1 Unit mA mA A A V V V V V V mV/V k C Fig. 1a 1a 1a 1a 1c 1d 1d 1c 1b 1a 1a 2/7 TDA2270 Figure 1 : DC Test Circuits Figure 1a : Measurement of I1 ; I8 ; I15 ; I16 ; V9 ; V9/VS ; R9 Figure 1b : Measurement of V7H 2270-03.EPS S1 : (a) I15 ; (b) I16, I7 and I8. S2 : (a) I7 and I8 ; (b) I16, (c) I15. S3 : (a) I15, I16, I7, I8, I9 and V9 ; (b) R9 Figure 1c : Measurement of V2L ; V7L Figure 1d : Measurement of V7 2270-05.EPS S1 : (a) V2L ; (b) V7L 3/7 2270-06.EPS 2270-04.EPS TDA2270 Figure 2 : Application Circuit Figure 3 : PC Board and Component Layout (1 : 1 scale) 4/7 2270-08.TIF 2270-07.EPS TDA2270 COMPONENTS LIST FOR TYPICAL APPLICATIONS (refer to the fig. 2) Component RT1 R1 R2 R3 R4 R5 R6 R7 D1 C1 C2 el. C3 el. C4 C5 el. C6 el. B/W TV 10 / 20 mH / 1 App 10 10 5.6 15 6.8 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 1000/25 V 10/16 V 90 TVC 15 / 30 mH / 0.82 App 10 12 5.6 18 5.6 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 1000/16 V 10/16 V Unit k k k k k - F F F F F 2270-04.TBL F TYPICAL PERFORMANCE Parameter Vs - Supply Voltage Is - Current tfly - Flyback Time * Ptot - Power Dissipation * Rth c- a - Heatsink Tamb Tj max to Vi V7 - Flyback Voltage B/W TV 10 / 20 mH / 1 App 20 145 0.75 1.8 14 60 130 20 2.5 42 90 TVC 15 / 30 mH 25 125 0.7 2.05 12 60 130 20 2.5 52 Unit V mA ms W C/W C C Vpp Vp 2270-05.TBL ms 5/7 TDA2270 MOUNTING INSTRUCTIONS The Rth j-amb of the TDA 2270 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (fig. 4) or to an external heatsink (fig. 5). The diagram of figure 6 shows the maximum dissipable power P tot and the Rth j-amb as a function of the side"l" of two equal square copper areas having Figure 4 : Example of P.C. Board Copper Area which is Used as Heatsink a thickness of 35 (1.4 mils). During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 5 : External Heatsink Mounting Example 2270-09.EPS Figure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance versus Side "l" Figure 7 : Maximum Allowable Power Dissipation versus Ambient Temperature 6/7 2270-11.EPS 2270-12.EPS 2270-10.EPS TDA2270 PACKAGE MECHANICAL DATA 16 PINS - PLASTIC DIP a1 I b Z B e3 e L b1 E D 16 9 F 1 8 Dimensions a1 B b b1 D E e e3 F i L Z Min. 0.51 0.77 Millimeters Typ. Max. 1.65 Min. 0.020 0.030 Inches Typ. Max. 0.065 0.5 0.25 20 8.5 2.54 17.78 7.1 5.1 3.3 1.27 0.020 0.010 0.787 0.335 0.100 0.700 0.280 0.201 0.130 0.050 DIP16.TBL Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 7/7 PM-DIP16.EPS |
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